Brand

GIGABYTE

Model

B560 HD3 (rev. 1.2)

Socket

Intel LGA1200

Chipset

Intel B560

CPU Support

11th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors

10th Generation Intel® Core™ i9 processors / Intel® Core™ i7 processors / Intel® Core™ i5 processors / Intel® Core™ i3 processors/ Intel® Pentium® processors / Intel® Celeron® processors*

Memory Standard

11th Generation Intel® Core™ i9/i7/i5 processors: Support for DDR4 5333(O.C.) / DDR4 5133(O.C.) / DDR4 5000(O.C.) / 4933(O.C.) / 4800(O.C.) / 4700(O.C.) / 4600(O.C.) / 4500(O.C.) / 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz

10th Generation Intel® Core™ i9/i7 processors: Support for DDR4 2933/2666/2400/2133 MHz memory modules

10th Generation Intel® Core™ i5/i3 /Pentium®/Celeron® processors: Support for DDR4 2666/2400/2133 MHz memory modules 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture

Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)

Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules

Support for Extreme Memory Profile (XMP) memory modules

Memory Slots

4 x DDR4 DIMM

Max Memory

128 GB

Expansion Slot

1 x PCI Express x16 slot, running at x16 (PCIEX16

1 x PCI Express x16 slot, running at x4 (PCIEX4)

2 x PCI Express x1 slots

Storage Devices

1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_CPU)(Note) Chipset:

1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB)

6 x SATA 6Gb/s connectors

Audio

Realtek® Audio CODEC

High Definition Audio

2/4/5.1/7.1-channel

Support for S/PDIF Out

LAN

Realtek® GbE LAN chip (1000 Mbit/100 Mbit)

Wireless Data Network

None

USB

6 x USB 3.2 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header)

6 x USB 2.0/1.1 ports available through the internal USB headers Chipset+USB 2.0 Hub

2 x USB 2.0/1.1 ports on the back pane

Internal I/O Connectors

1 x 24-pin ATX main power connector

1 x 8-pin ATX 12V power connector

1 x CPU fan header

1 x water cooling CPU fan header

3 x system fan headers

1 x addressable LED strip header

1 x RGB LED strip header

2 x M.2 Socket 3 connectors

6 x SATA 6Gb/s connectors

1 x front panel header

1 x front panel audio header

1 x USB 3.2 Gen 1 header

3 x USB 2.0/1.1 headers

1 x S/PDIF Out header

2 x Thunderbolt™ add-in card connectors

1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)

1 x serial port header

1 x parallel port header

1 x Clear CMOS jumper

1 x Q-Flash Plus button

Back Panel Connectors

2 x USB 2.0/1.1 ports

1 x PS/2 keyboard/mouse port

1 x D-Sub port

1 x DVI-D port

1 x DisplayPort

1 x HDMI port

4 x USB 3.2 Gen 1 ports

1 x RJ-45 port

6 x audio jacks

Power Pin

1 x 24-pin

1 x 8-pin

Case spec

ATX

Dimensions

(W x D x H) : 30.5 x 22.5 cm

Warranty

3 Year