GIGABYTE B660M DS3H DDR4 LGA1700
- GIGABYTE B660M DS3H DDR4
- LGA1700
- INTEL B660
- Memory 4x DIMM DDR4
- Micro ATX Form Factor
- รับประกันศูนย์ 3 ปี
- สินค้าใหม่ มือ 1
- สามารถออกใบกำกับภาษีได้
- สินค้ามีปัญหาจากโรงงาน สามารถเปลี่ยนสินค้าใหม่ได้ ภายใน 7 วัน จากวันที่สั่งซื้อ
- ทางบริษัทฯ ขอสงวนสิทธิ์ ในการรับผิดชอบใดๆ อันเนื่องจากข้อผิดพลาดทางการพิมพ์ (ผิด/ตก)
- ทางบริษัทฯ ขอสงวนสิทธิ์ ในการเปลี่ยนแปลงราคาและโปรโมชั่นโดยไม่แจ้งให้ทราบล่วงหน้า
Brand |
GIGABYTE |
Model |
B660M DS3H DDR4 |
Socket |
LGA1700 |
Chipset |
Intel B660 |
CPU Support |
LGA1700 socket: Support for 12th Generation Intel® Core™ i9 processors/Intel® Core™ i7 processors/Intel® Core™ i5 processors L3 cache varies with CPU |
Memory Standard |
Support for DDR4 3200/3000/2933/2666/2400/2133 MHz memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules |
Memory Slots |
4 x DDR4 DIMM |
Max Memory |
128GB |
Expansion Slot |
1 x PCI Express x16 slot, running at x16 (The PCIEX16 slot conforms to PCI Express 4.0 standard.) 2 x PCI Express x1 slots (The PCIEX1 slots conform to PCI Express 3.0 standard.) |
Storage Devices |
CPU: 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB) 4 x SATA 6Gb/s connectors Support for RAID 0, RAID 1, RAID 5, and RAID 10 Intel® Optane™ Memory Ready * System acceleration with Intel® Optane™ Memory can only be enabled on the M.2 connector supported by the Chipset. |
Audio |
Realtek® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. |
LAN |
Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) |
Wireless Data Network |
- |
USB |
Chipset: 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2 support 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header) 2 x USB 2.0/1.1 ports on the back panel Chipset+2 USB 2.0 Hubs: 4 x USB 2.0/1.1 ports available through the internal USB headers |
Internal I/O Connectors |
1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 3 x system fan headers 1 x addressable LED strip header 1 x RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x serial port header 1 x parallel port header 1 x S/PDIF Out header 1 x Q-Flash Plus button 1 x reset button 1 x reset jumper 1 x Clear CMOS jumper |
Back Panel Connectors |
2 x USB 2.0/1.1 ports 1 x PS/2 keyboard/mouse port 1 x D-Sub port 1 x HDMI port 2 x DisplayPorts 3 x USB 3.2 Gen 1 ports 1 x USB Type-C® port, with USB 3.2 Gen 2 support 1 x RJ-45 port 3 x audio jacks |
Power Pin |
1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector |
Dimension |
ATX Form Factor : 24.4cm x 24.4cm |
Warranty |
3 Year |